印能科技股份有限公司（AblePrint Technology Corp.）宣布，其創(chuàng)新第四代真空高壓高溫系統(tǒng) EvoRTS（Eliminate Void & Residue Terminator System，以下簡(jiǎn)稱RTS），榮獲 2025 年度 R&D 100 Awards 全球百大科技研發(fā)獎(jiǎng)。
R&D 100 Awards 由美國(guó)《研發(fā)世界》（R&D World）雜志主辦，素有「工程界的諾貝爾獎(jiǎng)」、「創(chuàng)新界的奧斯卡獎(jiǎng)」美譽(yù)，每年從全球選出 100 項(xiàng)最具創(chuàng)新與影響力的技術(shù)。
RTS采用印能科技最新控制氣流波動(dòng)技術(shù)，能在底部填膠（Underfill）固化過程中，有效清除助焊劑殘留（Flux Residue）與氣泡（Void），可協(xié)助助焊劑清洗機(jī)縮短清洗時(shí)間，更可進(jìn)一步完全免除水洗、烘干、與電漿清洗等后處理步驟，大幅提升：
制程效率：縮短周期、提升 UPH（單位產(chǎn)出率）
封裝良率：減少不良率與返工
永續(xù)發(fā)展：降低能耗，減少制程碳足跡
目前，RTS已成功導(dǎo)入多家客戶驗(yàn)證與量產(chǎn)，應(yīng)用成果顯著。除現(xiàn)有先進(jìn)封裝產(chǎn)品線外，更適合應(yīng)用在 AI、高效能運(yùn)算（HPC）等領(lǐng)域，具備高度擴(kuò)展?jié)摿Α?/p>
「我們?cè)谑嗄昵熬妥⒁獾街竸埩舻膯栴}，直到近年AI-Chiplet的應(yīng)用快速成長(zhǎng)，才讓這個(gè)解決方案變得迫切。多年來(lái)印能持續(xù)投入研發(fā)資源，最終完善了RTS技術(shù)。」
—印能科技董事長(zhǎng) 洪 志 宏
他強(qiáng)調(diào)，RTS不僅能同時(shí)解決大面積芯片封裝時(shí)的氣泡與助焊劑殘留難題，更為全球先進(jìn)封裝帶來(lái) 更綠色、更簡(jiǎn)化的新方案。
RTS的價(jià)值
延伸成熟制程生命周期：無(wú)需購(gòu)買昂貴新設(shè)備，即可沿用現(xiàn)有產(chǎn)線，降低先進(jìn)封裝資本支出。
改變游戲規(guī)則：簡(jiǎn)化制程，完全免除繁復(fù)的清洗與后處理步驟。
推動(dòng)制程永續(xù)：減少設(shè)備投資與能耗，協(xié)助客戶達(dá)成環(huán)保與碳中和目標(biāo)。
印能科技的研發(fā)實(shí)力已多次獲國(guó)際專家肯定。公司將持續(xù)走在客戶需求前端，以專業(yè)研發(fā)能量解決現(xiàn)有與未來(lái)的制程挑戰(zhàn)。此次獲獎(jiǎng)，再度彰顯印能在封裝制程創(chuàng)新、良率提升與綠色制造方面的深厚實(shí)力。
圖片來(lái)源：Announcing the 2025 R&D 100 Awards Winners
Press Release
AblePrint’s EvoRTS Wins 2025 R&D 100 Awards as a Top Global Innovation
[Hsinchu, Taiwan – August 25, 2025] –
AblePrint Technology Corp. announced that its innovative fourth-generation vacuum high-pressure and high-temperature system, EvoRTS (Eliminate Void & Residue Terminator System, hereafter RTS), has been honored with the 2025 R&D 100 Awards, recognizing it as one of the world’s top 100 innovations.
The R&D 100 Awards, presented by R&D World magazine since 1963, is widely regarded as the “Nobel Prize of Engineering” and the “Oscars of Innovation.” Each year, it highlights 100 of the most innovative and impactful technologies worldwide.
RTS leverages AblePrint’s latest airflow modulation control technology to effectively remove flux residue and voids during the underfill curing process. The system can not only shorten flux cleaning machine cycles but can even completely eliminate steps such as water cleaning, drying, and plasma cleaning, resulting in significant improvements in:
Process Efficiency: Reduced cycle time and improved UPH (Units Per Hour)
Packaging Yield: Lower defect rates and reduced rework
Sustainability: Reduced energy consumption and minimized carbon footprint
RTS has already been successfully verified and adopted by multiple customers in mass production, with outstanding results. In addition to its application in existing advanced packaging product lines, it is a perfect solution for AI and High-Performance Computing (HPC) packaging applications.
“We recognized the issue of flux residue more than a decade ago. With the rapid rise of AI-Chiplet applications in recent years, addressing this challenge became urgent. Over years of dedicated R&D investment, we perfected the RTS technology.”
— Mr. Horng Chih-Horng, Chairman of AblePrint Technology Corp.
He emphasized that RTS not only solves the dual challenge of flux residue and voids in large-area chip packaging, but also delivers a greener and more simplified solution for global advanced packaging.
Value of RTS
Extending Mature Process Life Cycles: No need for costly new equipment; existing production lines can be leveraged, reducing capital expenditure.
Game-Changer: Streamlined process that eliminates complex cleaning and post-processing steps.
Driving Sustainability: Lower equipment investment and energy consumption help customers achieve carbon neutrality and sustainable manufacturing.
AblePrint’s R&D capabilities have been recognized by international experts multiple times. The company remains committed to staying ahead of customer needs, using unique technological expertise to address both current and future process challenges.
This award once again highlights AblePrint’s leadership in packaging innovation, yield improvement, and sustainable manufacturing.
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Source：Announcing the 2025 R&D 100 Awards Winners
